Intel Compute Module HNS2600BPBR 2U 4-node HotSwap module DP Xeon scalable LGA3647 DDR4 SATA3 10GbE RJ45
Intel Compute Module HNS2600BPBR 2U 4-node HotSwap module DP Xeon scalable LGA3647 DDR4 SATA3 10GbE RJ45
Product Code: SY-IT-HNS2600BPBR
Manufacturer: Intel
Your Price: $1,280 / Each
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Intel Compute Module HNS2600BPBR for microcloud and high power computing solutions 2U 4-Node DP Xeon scalable LGA3647

Key Features
1. Intel® Xeon® ProcessorXeon scalable LGA3647 (Cascade Lake)
2. Intel® C622 chipset
3. 1 LP PCI-E 3.0 x16 slot, 1 LP PCI-E 3.0 x16 slot with M.2PCIe drive
4. up to 2.8TB DDR4 ECC RDIMM/LRDIMM 2933/2666/2400MHz in 16 DIMM sockets

Mfg. Part Number:
Intel HNS2600BPSR
RoHS Compliant

Server Type: 2U (shared)
CPU Socket per Node: 2
Memory Dimm per Node: 16
Expansion Slot per Node: 1 + 1
Power Supply Shared



Product Collection      Intel® Compute Module HNS2600BP Family

Code Name          Products formerly Buchanan Pass

Status     Launched

Launch Date       Q2'19

Expected Discontinuance      2022

Limited 3-year Warranty      Yes

Extended Warranty Available for Purchase (Select Countries)     Yes

Additional Extended Warranty Details    Intel® Compute Module HNS2000 Extended Warranty

Compatible Product Series     2nd Generation Intel® Xeon® Scalable Processors

MotherBoard Form Factor   Custom 6.8" x 19.1"

Chassis Form Factor    2U Rack

Socket    Socket P

Integrated Systems Available    Yes

Integrated BMC with IPMI    Yes

Rack-Friendly Board    Yes

TDP    165 W

Included Items:

(1) 1U node tray

(1) Intel® Server Board S2600BPBR

(1) Power Docking Board FHWBPNPB

(3) 40x56mm dual rotor managed fans FXX4056DRFAN2

(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS

(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS

(1) Air duct

(1) External VGA port bracket

(1) Slot 1 riser card

(1) Slot 2 riser card w/80mm M.2 SSD slot.

Required Items – Sold Separately:

(1) bridge board option - AHWBPBGB, AHWBP12GBGB, AHWBP12GBGBR5 OR AHWBP12GBGBIT;

(1) or (2) 2nd Generation Intel® Xeon® Scalable Processors,


Board Chipset    Intel® C621 Chipset

Target Market    High Performance Computing

Supplemental Information

Embedded Options Available    No

Description    A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPBR for large memory capability and flexible configuration options for the Intel® Server Chassis H2312XXLR3 or H2204XXLRE.

Memory Specifications

Max Memory Size (dependent on memory type)     2.8 TB

Memory Types    DDR4 ECC RDIMM/LRDIMM 2133/2400/2666/2933 & Intel® Optane™ DC Persistent Memory Supported

Max # of Memory Channels    12

Max # of DIMMs    16

ECC Memory Supported    Yes

Intel® Optane™ DC Persistent Memory Supported    Yes

Processor Graphics

Integrated Graphics    No

Graphics Output     VGA

Expansion Options

Max # of PCI Express Lanes    80

PCI Express Revision    3.0

Riser Slot 1: Total # of Lanes    16

Riser Slot 2: Total # of Lanes    24

Riser Slot 3: Total # of Lanes    24

Riser Slot 4: Total # of Lanes    16

I/O Specifications

# of USB Ports       2

USB Revision        3.0

Total # of SATA Ports       4

RAID Configuration    RAID Levels 0/1/10/5/50 (LSI)

# of Serial Ports    1

# of LAN Ports    2

Integrated LAN    Dual 10GbE RJ45 ports support

Package Specifications

Max CPU Configuration    2

Advanced Technologies   

Intel® Optane™ Memory Supported    Yes

Intel® Virtualization Technology for Directed I/O (VT-d)   Yes

Intel® Remote Management Module Support    Yes

Intel® Node Manager    Yes

Intel® Transparent Supply Chain

Includes Statement of Conformance and Platform Certificate    No

TPM Version   2.0

Security & Reliability

Intel® AES New Instructions    Yes

Intel® Trusted Execution Technology   Yes

This product is not refundable due to manufacturer return policy. We only replace or repair defective product by RMA procedure.

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